Micron launches 176-layer NAND flash and 1-alpha DRAM chips for the information economy

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Micron Technology unveiled new memory and storage items that it stated could far better serve information-driven enterprises as the information economy continues to create.

The new flash memory and dynamic random access memory (DRAM) chips had been made to deal with the bottleneck in feeding information involving memory, storage, and processing options in contemporary computer systems. Micron made the announcement at the virtual Computex trade show in Taiwan this week.

The new items consist of its initially 176-layer NAND flash and 1α DRAM technologies, as properly as what Micron touted as the industry’s initially Universal Flash Storage (UFS) 3.1 remedy for automotive applications. The items will serve every little thing from enterprises to games.

The new portfolio additions provide on the company’s vision of accelerating information-driven insights by way of innovations in memory and storage that allow new capabilities from the datacenter to the intelligent edge, Micron chief enterprise officer Sumit Sadana stated in a press briefing. He noted that the semiconductor business commonly grows quicker than the general world economy, and demand for memory and flash grows quicker than the semiconductor business. About 30% of the chip business is memory and storage.

“It is [going to be used] in end devices, whether mobile phones and laptops, in datacenter technologies, at the intelligent edge like industrial internet of things and smart automobiles,” Sadana stated. “Every segment of the market is going to be turbocharged for the next decade or two. Those are really exciting trends that bode well for the future.”

Micron announced volume delivery of its initially PCIe Gen4 strong-state drives (SSDs) constructed with what the corporation referred to as the world’s initially 176-layer NAND. This month the corporation is also shipping what it calls a further world’s initially, a 1α node-based LPDDR4x DRAM. LPDDR4x is the most current JEDEC specification for fourth-generation low-energy DRAM, featuring enhanced input/output voltage for substantially decrease energy, which tends to make it best for mobile computing devices. Together, Micron stated, these most current releases reinforce the company’s leadership position in each DRAM and NAND technologies, which it claimed to establish this year. PCIe Gen4 SSDs are anticipated to develop six occasions in the next two years, according to industry researcher Forward Insights.

These advances will aid the information economy deal with the explosion of information from AI and 5G. As these technologies attain mainstream deployment, they’re producing substantial amounts of information that memory and storage items have to hold up with.

The company’s most current SSDs, the Micron 3400 and 2450, provide higher efficiency and style flexibility with low energy consumption to allow all-day use from skilled workstations to ultrathin notebooks, Micron stated. The Micron 3400 SSD gives twice the study throughput and up to 85% larger create throughput compared to earlier generations, the corporation stated, enabling demanding applications like true-time 3D rendering, computer system-aided style, gaming, and animation.

For consumers looking for decrease expense PCIe Gen4 efficiency, the Micron 2450 SSD is obtainable in 3 kind components, as compact as the 22 x 30mm M.2, to provide immense style flexibility. Both Intel and Advanced Micro Devices have validated the tech for use with their processors. The Computer industry is now creating a million computer systems per day, Jeremy Werner, corporate vice president for storage at Micron, stated in a press briefing. Market researcher IDC expects the Computer industry to develop 18% in 2021, following 13% development in 2020.

Werner stated the SSD items are not vaporware, considering that they’re shipping today. Micron is shipping LPDDR4x in volume on its top 1α node this month, on the heels of its initial 1α node DRAM items in January 2021. The corporation also announced it has completed validation of its 1α-based DDR4 on top datacenter platforms, which includes 3rd Generation AMD EPYC. Both are in volume production in Micron’s sophisticated DRAM fabrication facilities in Taiwan, which includes its newly established A3 facility in Taichung.

Image Credit: Micron

Raj Hazra, senior vice president for compute and networking at Micron, stated in a press briefing that the Micron 1α-based memory gives sophisticated technologies to energy innovation from information-centric workloads on server platforms to consumers’ slim notebooks. The 1-alpha style enables energy-efficiency improvements for memory, enabling longer laptop battery life for each the work-from-home and study-from-home environments. Micron has partnered with Taiwan OEM Acer to integrate 1α-based LPDDR4x and DDR4 into Acer systems.

The 1α node approach gives a 40% improvement in memory density and up to 15% improvement in energy savings for mobile use situations when compared to earlier 1z node LPDDR4x, Hazra stated. This energy savings is best for mobile phones that need to preserve battery life, he stated, especially with memory-intensive use situations like capturing pictures and video.

For information-intensive automotive systems, Micron announced that it is sampling 128GB and 256GB densities of its 96-layer NAND as element of its new portfolio of UFS 3.1 managed NAND items for automotive applications. The ruggedized options can be applied for in-car entertainment and sophisticated driver help systems (ADAS) at the intelligent edge. ADAS cars now have more than one hundred million lines of computer software code that has to be stored and rapidly study for snappy user experiences.

The corporation stated UFS 3.1 gives 50% quicker sustained create efficiency to hold pace with the true-time regional storage requirements of increasing sensor and camera information for Level 3+ ADAS systems and black box applications.

Micron also stated its DDR5 technologies enablement system has now engaged more than 250 style and technical leaders from more than one hundred business leaders, which includes method and silicon enablers, channel partners, cloud service providers and OEMs.


Originally appeared on: TheSpuzz

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